GENTEN technology
Explore the laser, optical, imaging and measurement capabilities behind our processing, repair and inspection systems.
OUR CAPABILITIES
Precise, efficient and customized solutions. Smarter technology for better results.
Low energy. High efficiency. Low thermal impact. Precise, localized laser processing that protects surrounding structures.
Cutting, drilling, ablation, cleaning, repair, structuring, marking, welding and polishing.
Non-destructive observation of subsurface defects, particles, voids and multi-layer structures.
3D profilometry and precision structure analysis to provide reliable measurement data.
Process evaluation, optical and imaging integration, equipment automation and after-sales technical support.
Localized laser repair removes 3–5 μm of chipping at the TGV entrance, reducing stress concentration before copper filling. A 0.65 μm laser spot enables precise material removal without re-drilling or processing the deeper hole wall.
Micron-level accuracy
Minimize heat affected zone
Improve productivity and efficiency
Consistent and reliable quality
Shorter cycle time, higher output
Seamless integration, meet diverse needs
TECHNICAL EXPLORATIONS
Small details. More reliable copper filling.
Low energy. High efficiency. Low thermal impact.
Realize micron-level precision laser processing
Precision aperture shape restoration
Ultra-precision · Low thermal impact · High yield
See beyond the surface
See through · Precise inspection · Reliable results
FROM CHALLENGE TO SOLUTION
Tell us what you’re working on. We’ll explore the right technology together.
