From challenges to solutions
Start with your material and process challenge. We combine processing, inspection, measurement and automation into a solution tailored to your requirements.
TAILORED TO YOUR PROCESS
Localized repair for displays, substrates and masks. Firefly™ laser technology controls energy to minimize heat impact on surrounding structures.
Match laser processing to your material and task, from cutting and micro drilling to ablation, repair and polishing.
Inspect beneath surfaces and bonded layers to identify particles, voids and internal defects without destructive testing.
Evaluate hole depths, 3D profiles and microstructures with non-contact optical measurement for your inspection requirements.
Start with a feasibility evaluation, then integrate laser, optics, imaging, control software and automation around your process.
Combine localized entrance-edge repair with inspection and measurement to address chipping before copper filling. Removing damaged material at the entrance helps reduce stress concentration and subsequent glass-cracking risk, while leaving the deeper hole wall untouched.
A COMPLETE ENGINEERING APPROACH
One connected process. From understanding your requirements to a solution that works.
Understand the issue and define needs.
Evaluate methods and workflows.
Custom optical design for your application.
Optimize process and parameters.
Validate quality with precise data.
Integrate hardware, software & automation.
On-site support and technical service.
FROM CHALLENGE TO SOLUTION
Tell us what you’re working on. We’ll explore the right technology together.
