GENTEN
TGV Entrance Edge Repair
Small details. More reliable copper filling.
Remove visible 3–5 μm entrance chipping with localized laser processing. Repair only the entrance area to reduce the risk of cracks after copper filling, without re-drilling the via or processing the deeper hole wall.
Discuss your application
Repair the entrance. Preserve the wall.
The laser removes damaged material at the entrance with minimal material removal. The hole diameter increases only slightly. The deeper wall is not processed, preserving its original roughness to support copper adhesion.
- Localized repair — no re-drilling
- Maintain the hole profile
- Preserve wall roughness for copper adhesion
- Reduce glass-cracking risk after copper filling
Before and after entrance repair
- Before repair, before copper filling: visible 3–5 μm entrance chipping, with no surrounding cracks in the illustrated sample.
- After repair: the laser removes 3–5 μm of entrance chipping, with only a slight increase in hole diameter.
After copper filling: the comparison
The reference micrographs use 100 μm scale bars. These are observations from the supplied comparison samples, not a guarantee that every material and process will be crack-free. Discuss your glass, via geometry and copper-filling conditions with GENTEN.
- Without entrance repair: the illustrated sample shows radial cracks after copper filling, associated with stress concentration at the chipped entrance.
- With entrance repair: no cracks are observed after copper filling in the illustrated repaired sample.
FROM CHALLENGE TO SOLUTION
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