
LCD CF Direct Matrix Repair
Micron-level repair for high precision and localized defects.
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Application areas
Find repair, processing and inspection applications for displays, semiconductor substrates, glass and optical components.
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8 applications

Micron-level repair for high precision and localized defects.
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Repair local defects, improve yield, and meet next-generation display needs.
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High-precision micro leak repair, ensuring stable performance and excellent yield.
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Micron-level precision processing with low thermal impact and high yield.
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Precision laser repair for circuit defects, improving product quality and yield.
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Laser cutting, drilling and ablation for high-precision processing needs.
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3D profilometry and precision structure analysis to provide reliable measurement data.
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Address 3–5 μm entrance chipping in through-glass vias before copper filling. Localized repair preserves the hole profile and deeper wall roughness while reducing the risk of glass cracking after filling.
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