GENTEN
Observation of Conductive Particles Under Ink and Film
See through · Precise inspection · Reliable results
See the invisible. Inspect conductive particles under ink and film with confidence.
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Technology
Using high-resolution optical imaging and laser-based inspection, conductive particles under ink and film can be visualized, analyzed and classified, enabling process optimization and yield improvement.
- See through ink and film — Visualize hidden conductive particles
- High-resolution imaging — Clearly identify particle size and distribution
- Yield improvement — Enable quantitative analysis
- Non-destructive inspection
Inspection schematic
Inspection for ACF bonding: polarizer film with glue / ink / glass substrate / driver IC.
- ACF (Anisotropic Conductive Film)
- Conductive paste / ink
- Various substrates, flat panel displays, etc.
System features
- High-sensitivity optical system — Detects conductive particles under ink/film with high contrast
- Advanced image processing — Enhances particle visibility and provides clear differentiation
- High-resolution imaging — Captures fine particle details with excellent stability
- Comprehensive analysis software — Particle size, distribution, and quantity analysis for process control
Inspection examples
- Surface image (ink layer) — Conventional imaging shows only surface texture.
- Laser inspection image — Conductive particles under the ink layer become visible.
- High-resolution enlarged view — Enables detection of particles down to sub-micron size and accurate distribution analysis.
Applications
- LCD / OLED — Panel manufacturing
- Semiconductor — Packaging
- ABF substrates — High-density inspection
- TGV substrates — High-density inspection
- Optical components — Internal particle inspection
- Display materials — Bonding inspection
Precise inspection. Real quality. Higher yield.
- Process optimization
- Quality assurance
- Yield improvement
FROM CHALLENGE TO SOLUTION
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