GENTEN
Transmission Observation Microscope
See beyond the surface
No disassembly required — Directly observe internal foreign particles, defects and fibers inside bonded structures.
Discuss your application
Direct observation after bonding
View internal foreign objects through transparent substrates / encapsulation layers.
3D height information
Analyze defect height distribution with high precision and accurate positioning.
High-resolution imaging
Micron to sub-micron resolution. Clearly identify tiny particles and fibers.
Direct microscopic image after bonding
Through transmission observation, internal fibers, particles and foreign objects can be directly seen after bonding.
3D height mapping and distribution analysis
3D height map shows the height distribution of internal defects. Color scale range: 0.017–0.863 mm.
Actual internal defects after bonding
After actual sample bonding, a large number of particles, debris and fibers remain inside the structure.
Key advantages
- Transmission observation — View internal bonding conditions
- Accurate positioning & analysis — Understand defect location and distribution to improve yield
- High-resolution imaging — Micron to sub-micron resolution clearly reveals internal foreign objects
Application areas
- LCD / OLED / Mini LED — Display panel defect inspection
- Optical thin films & touch modules — Internal defects analysis after bonding
- Semiconductor packaging — Internal foreign object detection after bonding
- ABF substrate — Micro via and interconnect structure inspection
- TGV substrate — Micro via inspection
- Optical components — Internal cleanliness inspection
- Display modules — Bonding quality verification
Your partner in advanced inspection solutions
- Improve yield
- Reduce disassembly risk
- Strengthen quality control
FROM CHALLENGE TO SOLUTION
Put precision to work.
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